The XCVU11P-1FLGC2104E FPGA device provides the highest performance and integrated functionality on a 14nm/16nm FinFET node. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements.
Product attributes
Series: XCVU11P
Number of logic components: 2835000 LE
Adaptive Logic Module - ALM: 162000 ALM
Embedded memory: 70.9 Mbit
Number of input/output terminals: 512 I/O
Power supply voltage - minimum: 850 mV
Power Supply Voltage - Maximum: 850 mV
Minimum operating temperature: 0 ° C
Maximum operating temperature:+100 ° C
Data rate: 32.75 Gb/s
Number of transceivers: 96 transceivers
Installation style: SMD/SMT
Package/Box: FBGA-2104
Distributed RAM: 36.2 Mbit
mbedded Block RAM - EBR: 70.9 Mbit
Humidity sensitivity: Yes
Number of logical array blocks - LAB: 162000 LAB
Working power supply voltage: 850 mV
